Mechanical Engineer

CompanyEnercon Technologies Group
LocationNetanya, Israel
CategorySoftware Engineering
DepartmentR&D
Seniority-
Workplace-
Posted2026-05-14
Estimated salary₪30K–37K (a market estimate, not the employer's figure)
Viacomeet

Description

Electronic packaging and electromechanical solutions for MIL hardened sub-systems.

Designing complex assemblies while keeping them easy to assemble and simple to repair.

Thermal design.

Interface with electronic engineers and PCB designers.

Responsibility for the entire mechanical manufacturing process – from design to serial production.

Design of test equipment and complementary components.

Support of production engineering department.

Leading academic institute graduate – mandatory.

6 to 8 years experience in electronic packaging – mandatory.

Knowledge and deep understanding of mechanical manufacturing processes such as CNC, milling, routing, turning, flange forming etc. – mandatory.

Expert user of CAD programs such Solid Edge.

Knowledge of and experience with military and aviation standards such as MIL-STD-810 and RTCA/DO-160

Background in power supply design – advantage

Background in thermal and strength analysis – advantage.

Experience in mechanical design of PCBs and electromechanical hardware selection – advantage.

Self-teaching ability. Ability to quickly learn and understand concepts.

High motivation.

Work in a team and individually.