External Package Innovation Engineer

Hiring: External Package Innovation Engineer

We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.

🔹  Role Overview

As an  EPI engineer , you will act as both a  Role Owner  and  Key Supporter  for OSAT-related development activities, ensuring robust execution from concept through production.

🔹  Key Responsibilities

✅  1. Role Owner (Strategic & Governance)

• Own and lead  OSAT-wide and cross-OSAT initiatives

• Define and deploy  standard development templates and success criteria  across OSATs

• Drive deployment of  Best Known Methods (BKM)  and lessons learned

• Develop and maintain  technology roadmap and capability assessment  for each OSAT site

• Provide  Package Innovation (PI) input  for:

• External site sourcing strategy

• Site selection process (jointly with interface manager)

• Lead  project governance , including:

• Overall project summaries

• Stoplight reporting

• Regular reviews per OSAT site

✅  2. Supporter (Execution & Project Delivery)

• Support  NPI & NTI projects  executed at external OSAT factories

• Ensure OSAT compliance with:

• Development processes

• Required documentation/templates

• Drive alignment on  SME (Subject Matter Expert) assignment  at OSAT

• Support and resolve  technical and project issues  on-site and across time zones

• Ensure  assembly readiness and safe production launch

🔹  Stakeholder Collaboration

You will work closely with cross-functional teams, including:

• Project Leaders & Development Managers

• Designers & Materials Engineers

• Tech Integration & Modelling teams (Electrical, Mechanical, Thermal)

• API and WLP/PLP/FC SMEs

• OSAT partners

🔹  What We’re Looking For

• Strong experience in  semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding).  Previous exposure to OSAT ecosystem is an added advantage.

• Proven ability to manage  cross-site, cross-functional projects

• Solid understanding of  NPI/NTI development flows

• Excellent  stakeholder management and communication skills

• Ability to drive  standardization, governance, and technical problem-solving

🌟  Why Join Us

• Opportunity to lead  high-impact package innovation initiatives

• Work with  global teams and OSAT partners for wide exposure and fast knowledge & skill growth

• Drive  technology roadmap and next-generation packaging solutions

More information about NXP in Malaysia...

#LI-633a