Senior/Principal EDA Engineer, Electronic Design Automation, Texas Institute for Electronics
Description
Job Posting Title
Senior/Principal EDA Engineer, Electronic Design Automation, Texas Institute for Electronics
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Hiring Department
Texas Institute for Electronics
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Position Open To
All Applicants
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Weekly Scheduled Hours
40
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FLSA Status
To Be Determined at Offer
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Earliest Start Date
Ongoing
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Position Duration
Expected to Continue
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Location
PICKLE RESEARCH CAMPUS
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Job Details
General Notes
About TIE
Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.
Our Mission
A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices.
Our Impact
Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.
Our Technology
Our 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact.
Purpose
The Principal EDA Engineer will drive the hands-on implementation of electronic design automation (EDA) solutions for TIE’s multi-component and chiplet integration platforms. The Principal Engineer will focus on developing and optimizing design kits, simulation methodologies, and reference flows from concept to deployment, acting as a key technical contributor and innovator.
Responsibilities
Senior EDA Engineer
- Support the EDA implementation roadmap for TIE; multi-component and chiplet integration platforms, working hands-on with design kits, simulation tools, and reference flows.
- Develop and maintain comprehensive process design kits (PDKs) and assembly design kits (ADKs), including modeling, verification, and enablement collateral to accelerate customer adoption.
- Work directly with EDA tools (Synopsys, Cadence, Ansys, Siemens) and packaging design teams to integrate electrical, thermal, and mechanical simulation workflows. Serve as a technical resource in design reviews and customer engagements.
- Work on Jira, Version Control tools to enable the Internal and External Development teams.
- Apply AI based deployment of the EDA flows, PDK development.
- Collaborate with engineering, packaging design, product marketing, and EDA vendors to ensure design enablement flows are validated, documented, and continuously refined.
- Create detailed technical documentation, user guides, reference flows, and onboarding materials to support customer design teams.
- Assist in program planning activities covering scope, schedules, risk mitigation, and resource allocation to support predictable execution.
- Monitor EDA market trends and competitive developments, providing technical insights to guide tool integration decisions and platform improvements.
- Support program transparency and accountability, ensuring technical deliverables are on track and stakeholders are informed of progress and risks.
Principal EDA Engineer
- Drive the strategic vision and implementation roadmap for EDA across TIE; multi-component and chiplet integration platforms—spanning design kits, simulation tools, and reference flows from concept to production deployment.
- Lead technical development of comprehensive process design kits (PDKs) and assembly design kits (ADKs), including multi-physics modeling, qualification strategies, and customer enablement collateral. Own roadmap decisions and quality standards.
- Set technical direction for EDA packaging workflows, establishing best practices and qualification criteria that span electrical, RF, thermal, and mechanical simulation domains. Represent TIE as a technical authority in industry working groups, customer design reviews, and ecosystem partnerships.
- Manage relationships with TIE subcontractors, vendors, and EDA partners (Synopsys, Cadence, Ansys, Siemens). Define clear Statements of Work (SoW) with quantifiable metrics, monitor milestone progress, and adjust deliverables and payable milestones as needed to ensure accountability.
- Drive cross-functional collaboration with engineering, packaging design, product marketing, and major EDA vendors to align design enablement flows, establish validation protocols, and continuously improve platform capabilities.
- Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication. Deliver predictable outcomes in fast-paced, multi-stakeholder engagements.
- Own the creation of comprehensive technical documentation, reference architectures, onboarding frameworks, and strategic collateral that position TIE as an EDA innovator and strengthen customer confidence.
- Monitor EDA market trends, competitive developments, and emerging technologies. Provide actionable strategic insights to guide tool integration roadmap, design enablement priorities, and platform differentiation.
- Champion a culture of accountability and transparency across all program workstreams. Ensure stakeholders are informed, expectations are clearly defined and communicated, and commitments are met. Mentor junior technical staff and build high-performing teams.
Required Qualifications
Senior EDA Engineer
- BS in Electrical Engineering, Computer Engineering, or related discipline.
- 8+ years of experience in Electronic Design Automation (EDA), semiconductor design enablement, or advanced packaging workflows.
- Deep technical expertise with Synopsys, Cadence, Ansys, or Siemens design flows for chiplet and heterogeneous integration.
- Hands-on experience building and deploying packaging-related PDKs/ADKs. Strong understanding of modeling, simulation, and qualification across electrical, RF, mechanical, and thermal domains.
- Exceptional communication skills. You can simplify the complex, create clear technical deliverables, and build trust with technical and business audiences.
- Startup DNA. You are energized by ambiguity, act with urgency, and take personal ownership of technical outcomes.
- Execution mindset. You have demonstrated experience working in a hands-on role driving technical progress across multiple initiatives.
- Location. Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible with travel up to 30–50%. Such arrangements are subject to University review and approval in relation to jurisdictional employment-related laws, rules, and regulations.
Principal EDA Engineer
- MS or PhD in Electrical Engineering, Computer Engineering, or a related discipline.
- 12+ years of experience in Electronic Design Automation (EDA), semiconductor design enablement, advanced packaging workflows, or related technical leadership.
- Demonstrated expertise with Synopsys, Cadence, Ansys, or Siemens design flows. Proven ability to guide tool strategy, qualification methodology, and integration roadmaps.
- Proven track record of designing, deploying, and managing PDK/ADK programs at scale. Deep expertise in multi-physics modeling, simulation qualification, and cross-domain validation strategies.
- Strong program management experience. Demonstrated success defining program scope, managing multi-stakeholder dependencies, holding teams accountable t