Senior or Principal Product Manager, Texas Institute for Electronics
Description
Job Posting Title
Senior or Principal Product Manager, Texas Institute for Electronics
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Hiring Department
Operational Services and Strategies
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Position Open To
All Applicants
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Weekly Scheduled Hours
40
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FLSA Status
To Be Determined at Offer
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Earliest Start Date
Ongoing
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Position Duration
Expected to Continue
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Location
AUSTIN, TX
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Job Details
General Notes
About TIE
Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.
Our Mission
A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices.
Our Impact
Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.
Our Technology
Our 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact.
UT Austin , recognized by Forbes as one of America’s Best Large Employers , provides outstanding employee benefits and total rewards packages that include
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Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
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Voluntary Vision, Dental, Life, and Disability insurance options
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Generous paid vacation, sick time, and holidays
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Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
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Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
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Flexible spending account options for medical and childcare expenses
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Robust free training access through LinkedIn Learning plus professional conference opportunities
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Tuition assistance
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Expansive employee discount program including athletic tickets
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Free access to UT Austin's libraries and museums with staff ID card
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Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
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For more details, please see Benefits | Human Resources and UT Austin Employee Experience | Human Resources and UT Austin Employee Experience | Human Resources
Purpose
The purpose of this role is to drive the product strategy and roadmap for TIE’s advanced 2.5D/3D microsystems integration platforms, ensuring alignment between engineering execution, market needs, and business objectives. By serving as the bridge between technical teams and customer requirements, you will facilitate cross-functional collaboration and strategic partnerships to enhance product success and industry presence.
Responsibilities
- Own the product strategy and roadmap for TIE’s advanced 2.5D/3D microsystems integration platforms, aligning engineering execution with market needs and business objectives. In this role (reporting into TIE’s Business Group), you will serve as the bridge between technical teams and customer requirements to drive product success.
- Author and maintain comprehensive Product Requirements Documents (PRDs) that guide TIE’s process development, EDA integration, and packaging engineering teams. You’ll ensure all stakeholders have a clear blueprint so development efforts remain aligned, efficient, and focused on the right prioriTIEs.
- Drive cross-functional collaboration across internal teams—including packaging R&D, process engineering, design automation, and product marketing—to ensure product features and releases are cohesive and aligned with overall strategy. You will be the key interface keeping everyone on the same page and moving toward common goals.
- Engage closely with customers and industry partners (e.g. leading foundries and advanced packaging providers) to align our capabilities with evolving industry needs. You will represent TIE in technical discussions, gather customer feedback, and form strategic partnerships that enhance our microsystems platform and ecosystem presence.
- Serve as a technical champion for 2.5D/3D integration – leverage your deep understanding of advanced packaging technologies to guide internal decision-making. You’ll act as a liaison in customer design reviews and industry forums, ensuring TIE’s solutions address real-world challenges in chiplet-based system design.
- Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication to drive predictable delivery of platform milestones. You will deliver results in fast-paced, multi-stakeholder engagements by managing dependencies and proactively resolving roadblocks.
- Create technical documentation and collateral (such as integration guidelines, reference designs, and user guides) that support customer design teams and highlight the unique value of TIE’s technologies. You’ll ensure our technical content and training materials enable rapid adoption and success for our ecosystem users.
- Monitor advanced packaging market trends and competitive developments , providing actionable insights to inform product positioning, feature prioritization, and differentiation. Your awareness of emerging standards and ecosystem shifts will help keep TIE at the forefront of the industry.
- Champion a culture of accountability and transparency across all product workstreams. You make sure stakeholders are informed, expectations are managed, and commitments are met — fostering trust and a shared sense of mission among teams.
- Other related functions as assigned.
Required Qualifications
- Education: BS in Electrical Engineering, Computer Engineering, or a related technical discipline.
- Industry Experience:
- Senior Product Manager: 5+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.
- Principal Product Manager: 10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.
- Technical Expertise: Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration techniques. You have direct experience developing or managing cutting-edge packaging solutions and understand the nuances of modeling, simulation, and reliability across electrical, thermal, and mechanical domains.
- Process & EDA Familiarity: Working knowledge of semiconductor fabrication processes and electronic design automation (EDA) flows for PDK/ADK creation and integration with major EDA vendor flows. You can effectively interface with process engineers and EDA teams, ensuring packaging solutions integrate smoothly with design and manufacturing workflows.
- Exceptional communication skills. You know how to simplify the complex, create clear deliverables, and build trust with both technical and business stakeholders. You excel at translating between engineering and market/customer contexts.
- Startup DNA. You’re energized by ambiguity, act with urgency, and take ownership of outcomes. You thrive in a fast-paced, dynamic environment and aren’t afraid to wear many hats to ge