Micron Technology
Micron Technology jobs
301 open roles in Boise, Singapore, Main Site and 44 more
301 open roles
- Facilities Electrical Coordinator
- Sr AI Engineer, Platform
- Intern - Process Development Engineer, DRAM Thin Films
- Senior Engineer, Global Facilities - Chem
- ID Construction Quality Assurance Lead
- New College Grad - HBM Design Architect | MS or PhD
- Field Applications Engineer - Associate
- Senior CMP Equipment Engineer
- Logistics Security Intelligence Analyst
- Senior Manager, Logistics Security Program
- Logistics Security Program Manager, Europe, Middle East, and Africa (EMEA) Region
- DRAM Process Integration Engineer
- Product Development Engineer
- Staff Process Engineer, Advanced Packaging CMP
- SR ATSM NETWORK SUPPLY MANAGER II
- F10 Facilities Technician,Electrical
- Staff STPG NAND Product Development Engineer
- ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)
- Staff AI Engineering
- Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer
- Global Quality FrontEnd Central Quality Assurance Engineer
- Technician, Process Control Systems (PCS)
- Director, Technology Engineering & Innovation (TE&I) – India
- PRINCIPAL STRATEGY PROGRAM MANAGER – HIG HBM PSE
- Logistics Analyst
- Senior/Staff NAND Design Rule Engineer
- Senior Structured Data Access Control Process Analyst
- Intern - Government & Public Affairs (Global Policy)
- ENGINEER, DESIGN
- Staff AI Engineering
- New College Grad - PCVD Process Engineer
- ID1 Facilities Water Services UPW and Wastewater Coordinator
- New College Grad - HBM PYE Product Development Failure Analysis Engineer
- Process Engineer, APTD
- MTS, Systems Engineer
- Semiconductor Process Engineer
- Staff AI Full Stack Engineer
- Equipment Technician (AMHS-Automated Material Handling System) (Manassas)
- DRAM Design Validation Engineer
- MTS Process Integration Engineer | APTD Die Level Technology
- Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)
- Firmware Engineer
- Technician - Global Engineering Labs
- MTS, Interface Pathfinding Hardware Development Engineer
- QE Engineer
- Semiconductor Package Electrical Engineer
- Staff IT Risk Analyst
- Sr. Equipment Engineer(Taichung/Taoyuan)
- Engineer/Senior Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)
- Advanced CMOS Device & Process Integration Engineer
- YIELD ENHANCEMENT ENGINEER
- Advanced Technology Engineer (Wet Process) / 先端半導体技術エンジニア（ウェットプロセス）
- Staff Engineer, ASIC IP STA
- Staff Engineer, ASIC STA
- Senior Manager/ Manager - Memory Circuit Design
- Senior/Staff Engineer CPQE Deviation Management
- IT Project Manager
- Advanced CMOS Device & Process Integration Engineer
- Engineering Excellence Engineer 2
- STAFF ENGINEER, TDT PD CMP
- Engineer - STPG PE NAND
- Engineer, MRDA
- CMP工程シフトエンジニア（製造開発エンジニアリング／シフト勤務）‐ CMP Shift Engineer, Manufacturing Development Engineering
- Staff Engineer, Design
- Logistics Analyst
- Engineer, MTB PWF CVD/PVD EQ
- Senior/Principal Engineer, FE OCT CPEE PHOTO METROLOGY
- ENGINEER, PDE HBM NPI
- Principal ASIC Design Engineer
- PI3 Cell Engineer
- Staff/Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)
- SR MANAGER, MSI INDUSTRIAL ENGINEERING
- Staff Chemical Engineer
- Sr. Metallization Equipment Engineer
- Advanced CMOS Device & Process Integration Engineer
- OMT Equipment (SHIFT) Engineer
- Intern - MSB Automation Engineer
- Staff Engineer, IE AMHS
- Intern - ID1 Manufacturing Engineer
- Intern - ID1 Process Engineer
- Senior Industrial Engineer (project management)
- Staff Equipment Development Engineer - Advanced Packaging
- Sr. Director, Business Development - Cloud Memory
- Senior Industrial Engineer (project management)
- Intern - ID1 Equipment Engineer
- Full Stack AI Engineer (Industrial and Physical AI)
- Wet Process Equipment Technician
- Intern Design Engineer - HIG HBM
- Intern - Category Supplier Management
- New College Grad - Engineer, DPG Compute PE Y/Q
- Staff Memory Design Engineer, HBM
- Package Design and Development Quality Assurance Engineer - Data Analytics
- VP, Boise FE Manufacturing Operations
- Senior Manager, Industrial Segment & Distribution Operations
- Executive Search Program Coordinator (Contract)
- Photo DRAM Sr Engineer
- Senior AEBU Distributor Operations Analyst
- Sr Design Automation Engineer, Simulation
- Foundry PDK / Collateral Integration Engineer (CAD/EDA)
- Staff Engineer – HIG Component Validation
- Staff Physical Design Verification, CAD
- Principal, Social Impact & Community Engagement
- Senior or Staff Photolithography Materials Engineer
- DRAM Design Development Quality Engineer
- IT System Engineer (Field Service in Tainan)
- Memory Circuit Design Engineer
- Senior/ Staff Design Automation Engineer, Scribe Layout Design Non-Array
- IT Network Engineer 網路工程師
- Sr. Strategic Category Analyst II – Construction & Capital Projects
- IT System Engineer (Server and Virtualization)
- IT STORAGE ENGINEER
- Staff/Principal Engineer, Product Engineering, Media Health Reliability, HIG-HBM
- Software Engineer
- IT System Engineer (WorkPlace)
- Principal Engineer (Advance Data Analytics), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering
- MTB Defect Insight Engineer
- 緊急應變中心工程師 (ERC)
- IT System Engineer (Field Service in Tunglo)
- TECHNICIAN - F10 MANUFACTURING PRODUCTION
- IT STORAGE ENGINEER
- ADTT Dry Etch MTS
- IT System Engineer (Server and Virtualization)
- Process Technician
- IT Network Engineer 網路工程師
- Memory Circuit Design Engineer
- Sr Data Scientist
- ENGINEER, F16N HVM PROD. SIA(Taichung/Tainan/Tongluo/Taoyuan)
- IT DATABASE ADMINISTRATOR
- Test Process Technician
- Photo Mask Technician
- SR. Process Engineer, PHOTO SCANNER (Tongluo, Miaoli)
- Facilities – Sr Manager
- Intern - ADTS ATI PI
- Intern - STPG PE Business Operations
- Intern - Vertical Product Engineer (VPE)
- Intern- Silicon Design Validation Engineer
- Intern - PEE CVD/PVD
- Principal Signal Integrity Engineer, Pathfinding
- Intern - Assembly NPI
- Principal Analog Design Engineer — Mixed-Signal PHY (Clocking / High-Speed I/O)
- Intern - F10 PEE WET
- Intern - Manufacturing Dry Etch
- Senior Director, Technology Engineering & Innovation (TE&I)
- Intern - Facilities Sustainability AI
- Intern - PIE YE
- CAD Engineer
- Intern - MFG PHOTO
- Principal Engineer - HIG Component Validation
- AI Reimagination Engineer
- Physical Design Engineer
- AI Reimagination Engineer
- EUV Equipment Engineer
- Intern - Design Engineer, HIG HBM
- Senior Engineer, Device Characterization
- PMO TBO - Office Layout Planning
- Staff Engineer, FE Central Planning Strategic Program
- Senior Product Owner , SMART MFG & AI
- Central Planning Modeling Engineer
- Staff Engineer, FE OCT CPEE HVM DRY ETCH
- SMAI Senior Data Scientist
- HBM Advanced Package Sr. Process / Equipment Engineer
- QE Engineer
- Intern - Product Engineering, NAND Validation/Characterization
- Principal Engineer – 3D NAND Process Integration
- CAD Engineer / Electronic Design - Munich (m/f/d)
- Intern - Indirect Regional Supplier Manager
- Construction Engineer- CSA
- Staff Engineer, FE Central Planning Strategic Program
- Intern - STPG Product, NAND
- Photo Mask Technician
- F11 Metrology Application Engineer
- SR. HBM EQUIPMENT ENGINEER
- Senior / Staff RDA Process Engineer
- Sr. Engineer, Design
- Principal Layout Designer
- New College Grad - Shift Manufacturing Engineer
- Intern - Probe Equipment Engineer
- New College Grad - Dry Etch Process Engineer
- DRAM Process Integration Engineer
- Intern – DRAM Technology Physical Design and Block-Level PPA Optimization
- AI Reimagination Engineer
- Intern - Probe Manufacturing Engineering (Probe AME)
- Intern- ID1 Equipment Engineer
- New College Grad - Films, Metals, and Implant MDE Shift Engineer
- New College Grad - Photolithography MDE Shift Engineer
- Staff, Corporate Pilot
- Mechanical/Thermal Principal Design Engineer
- Intern - ATE Process Engineer ID1
- New College Grad - Engineer, Node Development PE
- New College Grad - Engineer, Node Development PE
- Staff Engineer, HBM Test Vehicle Design
- PRINCIPAL ENGINEER, CONTROLLER QUALITY
- DRAM Device & Cell Technology Engineer
- Staff, Corporate Pilot
- HBM SoC RTL Design Engineer
- Senior Layout Designer
- Intern – Procurement Cost Analyst
- Fab Process Technician
- Sr. Director Semiconductor Sourcing and NPI Procurement
- DMTS Process Development Engineer, Advanced Packaging
- TIQ Program Manager - US Expansions
- Intern - Design Engineer, HBM
- ENGINEER - PLN Operation Intelligence
- Principal, Regional Talent Development
- ENGINEER - PLANNING IE
- Advance Packaging Process Development Engineer
- Senior Test Equipment Engineer
- Program Manager – Chip Design
- Engineer, IT
- Graduate Engineering Technician
- Engineer - Planning (Materials and Spares Planning)
- Equipment Technician
- Smart System Technician
- Engineer, Customer Validation, SSD
- New Product Introduction (NPI) Planning Engineer
- ENGINEER - Planning (Layout)
- Graduate Engineering Technician
- Intern - Probe Automation
- ENGINEER, OMT RAM RDA PROCESS
- Factory Operations Analyst
- Principal Engineer – HBM PE Component Validation (Singapore)
- F10 Planning Site Inventory Control (SIC) Engineer
- QE Engineer
- ENGINEER, OMT TECHNOLOGY PI3 CELL-2
- Intern - Test Solutions, NVM
- Senior Technician, GQ Central Planning Planner
- SR DATA SCIENTIST, SMAI OI
- TEST Production Shift Supervisor
- Fab Process Technician
- Staff Engineer, Firmware and Product Test Engineering
- RDA Principal Lead Engineer
- AI Security Engineer
- Staff Solutions Engineer, EHSS Solutions
- ENGINEER - Planning (Operations Modelling)
- Test Equipment Engineer
- Intern, Photo Manufacturing Data Analytics and AI
- MTB Process Control System Technician
- Engineering Technician
- ENGINEER, F16 ME OMT Bench
- ENGINEER, SIG ELECTRICAL DESIGN
- Intern - PIE PI (Product Integration Engineering, Process Integration)
- Senior Design Engineer
- Intern - HIG PSE IE Management
- Intern - F10 Process Integration Analytics
- Intern - F10 PHOTO PEE
- Intern- Test Solutions Engineer
- ENGINEER, OMT TECHNOLOGY PI3 NPI
- Director, HVM EE DE/CB2
- Program Manager, Indirect Procurement Programs, Boise
- Logistics Security Program Manager - Asia Pacific Region
- Front End Supply Management Professional
- Director, OMT PEE PH
- ENGINEER - PROBE SHIFT EQUIPMENT
- Sr. Supply Manager, AT Supply Management- Capital
- DIRECTOR, HVM PRODUCTION 2
- Intern - MSB Test Engineering
- TF OPERATION PRPOCESS ENGINEER
- PRINCIPLE PROGRAM MANAGER
- GLOBAL EHS SENIOR CONSTRUCTION PROGRAM MANAGER
- MTS - HIG HBM - ARCHITECTURE
- Probe Manufacturing Shift Engineer
- Staff AI Engineer, SMAI
- Intern, Probe Process Control
- Principal NAND Reliability Product Engineer
- Taiwan Chemical LAB Shift Technician_Tainan
- Senior Engineer in Product Engineering, NAND Validation
- 半導体計測技術開発エンジニア/ Metrology Process Development Engineer
- Intern - TSE KEG Engineer
- New College Grad - Design Engineer
- Staff / Senior Product Engineer - Advanced Analytics
- Sales Development Representative
- CMP Process Engineer
- Senior Fire Protection Systems Engineer
- Fab Support Equipment Maintenance Technician
- Snr Specialist, Global People Services (HR)
- Chem/Gas/TGM Systems Technician
- CMP Process Development R&D Engineer
- Full Stack AI Engineer
- Senior/Staff Design Verification Engineer, HBM
- Intern - ASIC Digital Design
- Intern - Category Supplier Management
- Diffusion Equipment Shift Lead Engineer
- Toxic Gas Monitoring (TGM) Technician
- Staff Engineer, TPG IE Budgeting
- New College Grad - Indirect Category Supplier Manager
- Principal CAD Engineer/Manager
- MTS Firmware Engineer
- Construction Operations Lead
- Senior Design Engineer/Architect, HBM
- Engineer Lead/MGR , Tainan Manufacturing Section Manager
- SR. AI Engineer
- Engineer, Facility Construction Electrical
- Equipment Technician
- Technician, Electrical Failure Analysis (EFA)/Physical Failure Analysis (PFA)
- ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)
- NPI Planning Manager
- SENIOR DATA SCIENTIST
- Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)
- Snr/Test Equipment Engineer
- Entry-Level Process Integration Engineer