Xsight Labs
Software Engineering · 25 open jobs

Layout Design Engineer

Armenia, YerevanPosted Oct 8

Summary

We're looking for a senior layout design engineer with deep experience in custom memory layout at advanced process nodes to translate our SRAM circuit designs into manufacturable, matched, and parasitic-optimized silicon. Layout at the leading edge involves tighter design rules, multi-patterning and EUV constraints, and much less margin for error than at mature nodes.

Responsibilities

  • Create custom layout for bitcell arrays, sense amp periphery, and decoder logic under advanced-node design rules
  • Ensure tight matching and symmetry across critical circuit paths where advanced-node variation makes mismatch more costly
  • Run and close DRC, LVS, and parasitic extraction under complex multi-patterning or EUV-based design rule decks
  • Work with circuit designers to iterate on floorplan and minimize parasitic impact on timing/power, which is more sensitive at advanced geometries
  • Collaborate directly with the foundry or PDK team on manufacturability, restrictive design rules, and process-specific constraints
  • Support silicon debug by tracing layout-related root causes of failures, including those specific to advanced-node patterning

Required qualifications

  • 8+ years of custom IC layout experience, with specific SRAM or embedded memory layout on advanced process nodes
  • Direct experience laying out designs under multi-patterning or EUV design rule constraints
  • Strong command of DRC/LVS tools and custom layout editors at advanced nodes
  • Deep understanding of matching techniques and parasitic-aware layout practices where margins are tight
  • Experience closing layout on aggressive area targets without compromising yield, under restrictive advanced-node design rules

Preferred qualifications

  • Experience across multiple advanced-node foundry processes (not just one vendor)
  • Familiarity with memory compiler layout generation or parameterized layout scripting
  • Exposure to advanced packaging or 3D memory stacking layouts
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